• ACP Systems
    ACP Systems

    Residue and Chemical Free CO2 Cleaning

  • AMX Automation

    Pressure silver and copper sintering systems.

  • F&S Bondtec

    Fully automatic, semi-automatic and manual table top wire bonders and pull testers

  • PPI Systems
    PPI Systems

    Laser Resistor Trimming, Drilling and Cutting Systems

  • Nordson March
    Nordson March

    Plasma cleaning, treatment and coating systems.

  • Nordson Dage
    Nordson Dage

    Automated bond testing and x-ray metrology.

  • Nordson Sonoscan
    Nordson Sonoscan

    Acoustic microscopy for nondestructive acoustic testing and analysis.

  • Nordson Asymtek
    Nordson Asymtek

    Fluid dispensing and conformal coating equipment

  • Sikama

    Conduction and convection SMT reflow soldering ovens

  • Draeger

    Hazardous gas detection and safety systems

  • Amada Weld Tech
    Amada Weld Tech

    Comprehensive line of standard and custom systems for welding, bonding, sealing, marking and cutting needs.

  • Centrotherm

    Vacuum furnaces for vacuum soldering, brazing and sealing for microelectronics packages and components

  • Tresky Automation
    Tresky Automation

    Fully automatic, flexible and easy to program high accuracy die bonders

TEC Associates Inc. - Your Source for Wire Bonders & Process Equipment


TEC Associates is a Manufacturer's Representative and Distributor specializing in capital equipment and related products in the High Tech arena.


We offer a wide range of wire bonding machines and die bonder equipment. Contact us now to learn more about our manual, semi-automatic, or automatic wire bonders. We supply the Series 53, 56, 58 and 86 wire bonder machines from FS Bondtec


Contact us now for a quote for ball bonding, ribbon bonding, wedge bonding, or other gold & aluminum wire bonding equipment.