Comprehensive line of standard and custom systems for welding, bonding, sealing, marking and cutting needs.

High speed and fully automatic advanced packaging, electronics assembly, wire bonding and interconnect solutions

Vacuum furnaces for vacuum soldering, brazing and sealing for microelectronics packages and components

Fully automatic, semi-automatic and manual table top wire bonders and pull testers

Fully automatic, flexible and easy to program high accuracy die bonders

High-end 3D surface measurement systems for industrial and scientific applications.

Plasma cleaning, treatment and coating systems.

Automated bond testing and x-ray metrology.

Acoustic microscopy for nondestructive acoustic testing and analysis.

Fluid dispensing and conformal coating equipment

Conduction and convention SMT reflow soldering ovens

Thermal warpage metrology

Optical leak testing for hermetically sealed devices and packages

Hazardous gas detection and safety systems