• SEMI AUTOMATIC AND MANUAL DIE BONDERS
• FLIP CHIP APPLICATIONS
• EUTECTIC BONDING
• ULTRASONIC BONDING
• HIGH FORCE OPTION
• PICK FROM WAFER
For over 30 years, Tresky has been perfecting the art of creating handling and pick & place systems.
As a solutions provider, we support specific applications with our highly accurate and innovative systems. Starting from manual to automatic, from adhesives to tools, exactly as per our customer’s need. This is made possible by our extensive experience and modular setup which allows adapting various basic systems with countless options for new processes.
With almost one thousand devices installed across the world, often with special & customized equipment, we diligently work to fulfill complex process requirements. Supported by a fast, flexible and professional team ready to be tested, we look forward to your challenge!