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• HIGH SPEED AUTOMATIC WIRE BONDERS

• GOLD BALL BONDING 

• CHIP TO SUBSTRATE AND CHIP TO WAFER (C2S, C2W)

• HIGH DENSITY FAN OUT

• WAFER LEVEL BONDING

• LITHOGRAPHY

Kulicke & Soffa is a leading provider of semiconductor packaging and electronic assembly solutions supporting the global automotive, consumer, communications, computing and industrial segments. As a pioneer in the semiconductor space, K&S has provided customers with market leading packaging solutions for decades. In recent years, K&S has expanded its product offerings through strategic acquisitions and organic development, adding advanced packaging, electronics assembly, wedge bonding and a broader range of expendable tools to its core offerings. Combined with its extensive expertise in process technology and focus on development, K&S is well positioned to help customers meet the challenges of packaging and assembling the next-generation of electronic devices.

ConnX ELITE

ConnX Elite High Speed Ball Bonder