-
-
• FULY AUTOMATED DIE BONDERS
• FLIP CHIP BONDING
• THERMOSONIC BONDING
• ULTRASONIC BONDING
• DISPENSING
The T-6000-L/G is an enhanced version of the proven T-6000-L series. A fully automated all-purpose system built on a sophisticated granite gantry and high precision motion control system. T-6000-L/G can be upgraded with new loader and unloader modules. The throughput for the latest advanced packaging applications has been extremely improved. With numerous available options, the T-6000-L/G can be customized to suit all market needs. This system offers our customers the opportunity to grow from a manual manufacturing process to a fully automated process without any additional hardware changes. Just a few software clicks will guide you through this process.
-
|
• MULTI-ZONE BENCHTOP REFLOW OVENS
|
Sikama’s innovative line of SMT Reflow Soldering Ovens include both straight conduction systems and Sikama’s patented Conduction + Convection Ovens. Many of our systems are available with liquid cooling and optional software control for both data logging and remote operation, as well as an optional speed/time dwell mode. Our Sweeper Bar technology allows you to integrate our systems into automated production lines with our optional loading and off-loading accessories. The atmospheric control features found on many of our systems ensure quality bonding in an inert gas environment.
|
|
|
• BATCH PLASMA TREATMENT SYSTEMS • REACTIVE ION ETCHING SYSTEMS |
Nordson MARCH is the global leader in plasma cleaning and plasma surface treatment equipment, and plasma applications technology. The company has designed and manufactured plasma surface treatment equipment for more than 30 years and has broad experience in the areas of advanced semiconductor packaging and assembly, wafer level packaging (WLP), printed circuit board manufacturing, life science & medical device assembly, and various large-scale industrial applications.
|
|
|
• DISPENSING AND CONFORMAL COATING SYSTEMS |
Nordson ASYMTEK is a world leader in precision automated fluid dispensing, jetting and conformal coating We design and manufacture a full line of equipment for PCB and SMT assembly, semiconductor packaging, 3D and wafer-level packaging, camera module assembly, case and packaging assembly, LED assembly, and other precision manufacturing. We support our products with a global service network. Fluid Dispensing Systems and Equipment
|
|
